Short channel, memory module with stacked printed circuit boards
US6597062B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2002 |
| Grant date | Jul 22, 2003 |
| Priority date | — |
| Expiry date | Aug 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is a family of memory modules. In one embodiment a memory module with granularity, upgradeability, and high throughput of at least 4.2 gigabytes per second using two channels of RAMBUS memory devices in a typical volume of just 2.2 inches by 1.1 inches by 0.39 inch. Each module includes an impedance-controlled substrate having contact pads, memory devices and other components, including optional driver line terminators, on its surfaces. The inclusion of spaced, multiple area array interconnections allows a row of memory devices to be serially mounted between each of the area array interconnections, thereby minimizing the interconnect lengths and facilitating matching of interconnect lengths. Short area array interconnections, including BGA, PGA, and LGA options or interchangeable alternative connectors provide interconnections between the modules and the rest of the system. Thermal control structures may be included to maintain the memory devices within a reliable range of operating temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.