Holographic scatterometer for detection and analysis of wafer surface deposits
US6597446B2 · kind B2 · utility
21Cited by
19References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2001 |
| Grant date | Jul 22, 2003 |
| Priority date | — |
| Expiry date | Mar 29, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9501
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A holographic scatterometer with continuous readout can rapidly identify the presence of deposits (particles or other defects) on an unpatterned wafer surface and determine the volume density (size) and location. The scatterometer can also determine chemical composition of the detected deposits. The range of the deposit (particle) size to be measured is below 80 nm, which currently existing scatterometer type instruments cannot readily detect. The inspection can be achieved as an in-line stage during the processing of wafers or in situ in combination with another processing tool or as a separate off-line analysis device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.