Via connector and method of making same
US6598291B2 · kind B2 · utility
6Cited by
43References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2001 |
| Grant date | Jul 29, 2003 |
| Priority date | — |
| Expiry date | Apr 23, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An insulator substrate or printed circuit board (PCB) having a filled and plated via. A sidewall of the via and preferably opposite sides of the insulator substrate are first plated with a conductive material. The plated via is then filled with an electrically conductive fill composition. A conductive cap layer is preferably formed over both ends of the conductive fill composition and the opposite surfaces of the insulator substrate, and can be bonded to a surface mount contact as a land or a pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.