Soldering flux
US6599372B2 · kind B2 · utility
8Cited by
33References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2000 |
| Grant date | Jul 29, 2003 |
| Priority date | — |
| Expiry date | Dec 18, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31714
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A soldering flux includes a resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board. The resin can be non-acidic and/or in an emulsified form.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.