Field-effect semiconductor devices
US6600194B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2001 |
| Grant date | Jul 29, 2003 |
| Priority date | — |
| Expiry date | Mar 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/62
Abstract
A field-effect semiconductor device, for example a MOSFET of the trench-gate type, comprises side-by-side device cells at a surface (10a) of a semiconductor body (10), and at least one drain connection (41) that extends in a drain trench (40) from the body surface (10a) to an underlying drain region (14a). A channel-accommodating region (15) of the device extends laterally to the drain trench (40). The drain trench (40) extends through the thickness of the channel-accommodating region (15) to the underlying drain region (14a), and the drain connection (41) is separated from the channel-accommodating region (15) by an intermediate insulating layer (24) on side-walls of the drain trench (40). A compact cellular layout can be achieved, with a significant proportion of the total cellular layout area accommodating conduction channels (12). The configuration in a discrete device avoids a need to use a substrate conduction path and so advantageously reduces the ON resistance of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.