Dissolution of metal particles produced by polishing
US6602112B2 · kind B2 · utility
17Cited by
15References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2001 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | Aug 7, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for polishing a surface of metal on a semiconductor substrate by using a polishing pad and hydrogen peroxide, and removing particles of metal from the semiconductor substrate by polishing, and dissolving the particles in the quantity of hydrogen peroxide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.