Peter A. Burke
93Patents
19h-index
87Co-inventors
87Inventor score
Filing activity: Dec 11, 1992 → Apr 19, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5268330A | Process for improving sheet resistance of an integrated circuit device gate | Emerging Cross-Sectional Technologies | 101 | Expired |
| US6969651B1 | Layout design and process to form nanotube cell for nanotube memory applications | Emerging Cross-Sectional Technologies | 90 | Expired |
| US6955937B1 | Carbon nanotube memory cell for integrated circuit structure with removable side spacers to permit access to memory cell and process for forming such memory cell | Emerging Cross-Sectional Technologies | 83 | Expired |
| US6454634B1 | Polishing pads for chemical mechanical planarization | Performing Operations; Transporting | 75 | Expired |
| US5492594A | Chemical-mechanical polishing tool with end point measurement station | Electricity | 73 | Expired |
| US6749485B1 | Hydrolytically stable grooved polishing pads for chemical mechanical planarization | Emerging Cross-Sectional Technologies | 72 | Expired |
| US5356513A | Polishstop planarization method and structure | Electricity | 72 | Expired |
| US5645469A | Polishing pad with radially extending tapered channels | Performing Operations; Transporting | 68 | Expired |
| US5916855A | Chemical-mechanical polishing slurry formulation and method for tungsten and titanium thin films | Electricity | 66 | Expired |
| US6736709B1 | Grooved polishing pads for chemical mechanical planarization | Performing Operations; Transporting | 57 | Expired |
| US6860802B1 | Polishing pads for chemical mechanical planarization | Performing Operations; Transporting | 55 | Expired |
| US6582283B2 | Polishing pads for chemical mechanical planarization | Performing Operations; Transporting | 50 | Expired |
| US5510652A | Polishstop planarization structure | Electricity | 46 | Expired |
| US6987059B1 | Method and structure for creating ultra low resistance damascene copper wiring | Electricity | 43 | Expired |
| US7160805B1 | Inter-layer interconnection structure for large electrical connections | Electricity | 28 | Expired |
| US5934978A | Methods of making and using a chemical-mechanical polishing slurry that reduces wafer defects | Chemistry; Metallurgy | 24 | Expired |
| US5782962A | Cleaning and polishing composition | Chemistry; Metallurgy | 23 | Expired |
| US6093085A | Apparatuses and methods for polishing semiconductor wafers | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6106661A | Polishing pad having a wear level indicator and system using the same | Performing Operations; Transporting | 21 | Expired |
| US6051495A | Seasoning of a semiconductor wafer polishing pad to polish tungsten | Electricity | 19 | Expired |
| US6000281A | Method and apparatus for measuring critical dimensions on a semiconductor surface | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6602112B2 | Dissolution of metal particles produced by polishing | Performing Operations; Transporting | 17 | Expired |
| US6939800B1 | Dielectric barrier films for use as copper barrier layers in semiconductor trench and via structures | Electricity | 17 | Expired |
| US5753607A | Cleaning and polishing composition | Chemistry; Metallurgy | 15 | Expired |
| US6648743B1 | Chemical mechanical polishing pad | Performing Operations; Transporting | 14 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.