Substrate retaining ring
US6602116B1 · kind B1 · utility
38Cited by
6References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 3, 2000 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | May 14, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A retaining ring is configured for use with an apparatus for polishing a substrate. The substrate has upper and lower faces and a perimeter. The apparatus has a movable polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retaining ring has a retaining face for engaging and retaining the substrate against lateral movement and a bottom face for contacting the polishing surface of the polishing pad. The bottom face of the retaining ring extends downward from an inner portion adjacent the retaining face to a lowermost portion radially outboard of the retaining face.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.