Pad support apparatus for chemical mechanical planarization
US6602121B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 20, 2000 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | Jun 13, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T483/174
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system for chemical mechanical planarization comprises a platen assembly for holding an object to be planarized and a polishing head comprising a puck holder assembly for coupling to a substrate for holding a polishing pad. The polishing pad is smaller in surface area than the object. The polishing head is movable from a first region overlying the platen assembly to a second region. The puck holder assembly comprises a backing surface for positioning the substrate, and a clamp ring positioned proximate to the backing surface for supplying mechanical force to the substrate to hold the substrate in place during a polishing operation. A spring mechanism is disposed in the housing for resiliently biasing the clamp ring toward the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.