Method and apparatus for separating semiconductor chips
US6602736B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2000 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | Mar 24, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an apparatus for separating semiconductor chips, a semiconductor wafer stuck to an adhesive sheet with its silicon mirror surface facing downwards is sucked as a whole through its circuit surface side by means of a sucker plate capable of sucking the whole of wafer. In order to separate the sheet from a frame fixing the sheet while the sheet being sucked, the sheet is cut by a cutter edge so as to be separated from the frame. To separate the sheet from the wafer, the wafer top surface is guided by a guide plate having a tip angle of 15° and by causing the sheet to profile the tip of the guide plate, the sheet is peeled off in a direction making an angle of 45° to the dicing direction on the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.