Method for making multichip module substrates by encapsulating electrical conductors and filling gaps
US6602739B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2002 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | Mar 19, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/185
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making a multichip “HDI” module includes the step of making a substrate for supporting the semiconductor or solid-state chips (or other components) by applying electrical conductor in a pattern to a first dielectric sheet, and applying encapsulating material to the electrical conductor. Apertures are made in the first dielectric sheet and encapsulant at locations at which the chips (or other components) are to be located. The components are affixed to a second dielectric sheet at locations registered with the apertures in the first sheet, and the sheets are juxtaposed with the chips extending into the apertures. This results in the formation of gaps between the components and the edges of the apertures, which gaps are then filled with hardenable or curable material. Electrical connection is made to the pads of the chips by means of a multilayer structure of dielectric sheets with conductor patterns, interconnected by means of plated-through vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.