Porous materials
US6602804B2 · kind B2 · utility
21Cited by
15References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2002 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | Jul 1, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/96
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Porous dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous dielectric materials. Also disclosed are methods of forming integrated circuits containing such porous dielectric materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.