Adhesives for bonding composites
US6602958B2 · kind B2 · utility
14Cited by
16References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2001 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | Jul 10, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J4/06
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Adhesive composition, including a mixture of about 1 percent to about 35 percent by weight of chlorinated polymer, about 1 percent to about 35 percent by weight of a nitrile elastomer, a rubber-modified acrylonitrile copolymer, or mixtures thereof, and about 25 percent to about 90 percent by weight of an alkyl acrylate or methacrylate monomer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.