Semiconductor package
US6603193B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2001 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | Sep 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package having a molded body and a plurality of conductive pins that extend from the bottom of the molded body. The semiconductor package further includes a RF shield around a protected cavity that holds a first integrated circuit. The molded body can further include an unprotected plastic cavity for holding a second integrated circuit. The conductive pins form bonding pads that are used to electrically interconnect the first and second semiconductor devices to the external environment. A cover, beneficially comprised of copper, is disposed over the molded body. The plastic cavity beneficially includes a beveled wall that improves the routing of electrical conductors between the first integrated circuit and the second integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.