Method of separating composite member and process for producing thin film
US6605518B1 · kind B1 · utility
33Cited by
8References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2000 |
| Grant date | Aug 12, 2003 |
| Priority date | — |
| Expiry date | Apr 26, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/96
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To cause a crack at a fixed position in a separation layer, a method of separating a composite member includes the steps of forming a separation layer inside a composite member, forming inside the separation layer a stress riser layer in which an in-plane stress has concentratedly been produced to an extent that does not cause separation by the in-plane stress, and enlarging the in-plane stress to cause a crack in the stress riser layer, thereby separating the composite member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.