Semiconductor device with improved cooling efficiency and reduced electric resistance
US6605869B2 · kind B2 · utility
5Cited by
2References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 3, 2002 |
| Grant date | Aug 12, 2003 |
| Priority date | — |
| Expiry date | Apr 3, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a semiconductor device comprising: a tape wiring substrate; a semiconductor element mounted one main surface of the tape wiring substrate; a solder ball or pump electrode provided on the other surface of the tape wiring substrate while electrically connected with a predetermined position of the main surface of the tape wiring substrate including the semiconductor element; and a hollow pipe-shaped substrate; wherein the tape wiring substrate is wound around the hollow pipe-shaped substrate with the main surface arranged toward the hollow pipe-shaped substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.