Integrated electronic device comprising a mechanical stress protection structure
US6605873B1 · kind B1 · utility
21Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 1998 |
| Grant date | Aug 12, 2003 |
| Priority date | — |
| Expiry date | Feb 22, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The integrated electronic device comprises a protection structure of metal, extending vertically and laterally to and along a predominant part of the periphery of an electronic component integrated underneath the pad region. The protection structure comprises a substantially annular region formed from a second metal layer and absorbing the stresses exerted on the pad during wire bonding. The annular region may be floating or form part of the path connecting the pad to the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.