Method for specifying, identifying, selecting or verifying differential signal pairs on IC packages
US6606732B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2000 |
| Grant date | Aug 12, 2003 |
| Priority date | — |
| Expiry date | Apr 4, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/39
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An automated method of selecting differential pairs in an integrated circuit comprising loading the design database for the integrated circuit package, and selecting output parameters for the differential pairs comprises adjacency criteria for the different pairs, time of flight tolerances for the differential pairs, and the redistribution layers and their voltage references. The method then includes comparing the output parameters to the design in the design database, and obtaining a resulting differential pairs list. The differential pair list preferably includes differential signal pairs having electrical characteristics within a predetermined design tolerance range. At least some of the differential signal pairs may comprise individual wires or connectors not physically adjacent one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.