Positioning structure for heat dissipating fins
US6607028B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 29, 2002 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Jul 29, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A positioning structure for heat dissipating fins is provided. The heat dissipating fins is comprised of multiple metal plates, each of which comprising a main body, and a folded side portion connected to one or two sides of the main body. The positioning structure is disposed on each of the metal plates. The positioning structure comprises a protrusion located on the main body of the metal plate, an aperture being formed on the main body, the protrusion formed in the aperture; and a resilient snapping piece located on the folded side portion, the snapping piece corresponding to the protrusion and defining a buckling opening therein, the buckling opening being connected to a front opening having a width normally smaller than the width of the protrusion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.