Apparatus and method for ball release
US6607118B2 · kind B2 · utility
4Cited by
12References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2001 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Jul 5, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3478
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There is disclosed a method and apparatus for ensuring release of objects such as solder balls from a pick head in a transfer and placement apparatus, comprising causing said pick head to vibrate by applying a vibration signal to said pick head over a range of frequencies. The range of frequencies is chosen such that it bounds the resonant frequencies of the pick head which may be calculated by computer simulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.