Method of fabricating as grooved heat spreader for stress reduction in an IC package
US6607942B1 · kind B1 · utility
37Cited by
10References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2001 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Jul 26, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A new design is provided for the heat spreader of a semiconductor package. Grooves are provided in a surface of the heat spreader, subdividing the heat spreader for purposes of stress distribution into four or more sections. This division of the heat spreader results in a reduction of the mechanical and thermal stress that is introduced by the heat spreader into the device package. Mechanical and heat stress, using conventional heat spreader designs, has a negative, stress induced, effect on the semiconductor die, on the contact points (bump joints) of the semiconductor die and on the solder ball connections of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.