Lead frame with plated end leads
US6608366B1 · kind B1 · utility
90Cited by
72References
21Claims
0Family size
Inventors
Key dates
| Filing date | Apr 15, 2002 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Apr 15, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame comprising a frame which defines a central opening. Disposed within the central opening is a die pad which is connected to the frame. Also connected to the frame are a plurality of leads which extend within the opening toward the die pad. Each of the leads defines opposed top and bottom surfaces, an inner end, an outer end, and an opposed pair of side surfaces. The bottom surface and the outer end collectively define a corner region of the lead. Formed within the corner region is a recess which is sized and configured to accommodate the flow of reflow solder thereinto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.