Inventor · Peoria, AZ, US

Terry Davis

15Patents
11h-index
21Co-inventors
72Inventor score

Filing activity: Apr 13, 1989 → May 3, 2011

Most-cited inventions

PatentTitleAreaCited byStatus
US6448633B1 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant Electricity 212 Expired
US6608366B1 Lead frame with plated end leads Emerging Cross-Sectional Technologies 90 Expired
US7008825B1 Leadframe strip having enhanced testability Electricity 76 Expired
US7183630B1 Lead frame with plated end leads Emerging Cross-Sectional Technologies 66 Expired
US6841414B1 Saw and etch singulation method for a chip package Electricity 51 Expired
US6611047B2 Semiconductor package with singulation crease Electricity 30 Expired
US7960818B1 Conformal shield on punch QFN semiconductor package Electricity 25 Active
US5636745A Tray for a component and an apparatus for accurately placing a component within the tray Electricity 17 Expired
US7217991B1 Fan-in leadframe semiconductor package Electricity 16 Expired
US6825062B2 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant Electricity 12 Expired
US8729682B1 Conformal shield on punch QFN semiconductor package Electricity 12 Active
US4907506A Method and apparatus for controlling spring rate and leverage in a screen printing device Performing Operations; Transporting 8 Expired
US7057280B2 Leadframe having lead locks to secure leads to encapsulant Electricity 6 Expired
US7473584B1 Method for fabricating a fan-in leadframe semiconductor package Electricity 3 Active
US7564122B2 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant Electricity 3 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.