Integrated circuit package substrate with high density routing mechanism
US6608376B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2002 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Mar 25, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09627
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package is provided that allows high density routing of signal lines. A substrate of the package may include an upper surface upon which a bonding finger resides, a lower surface upon which a solder ball resides, and a signal conductor plane on which a signal trace conductor resides a dielectrically spaced distance between the upper surface and the lower surface. A first via may extend perpendicularly from the upper surface, connecting the bonding finger to the first portion of the signal trace conductor. A second via may extend perpendicularly from the lower surface, connecting the solder ball to the second portion of the signal trace conductor. The routing of the vias and signal trace conductors may cause the signal lines to either fan into or away from the area of the integrated circuit package adapted to receive the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.