Reference plate, exposure apparatus, device manufacturing system, device manufacturing method, semiconductor manufacturing factory, and exposure apparatus maintenance method
US6608666B2 · kind B2 · utility
8Cited by
16References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2001 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Jun 18, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7076
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A reference plate used with an exposure apparatus that emits an exposure beam to irradiate a reference mark pattern with observation light, to detect the reflected light, and to obtain a position of the reference mark pattern. A respective reference plate is fixed on a mask stage and a wafer stage of the exposure apparatus for exposing a wafer on the wafer stage to a mask pattern on the mask stage, and a surface of the reference mark pattern, which is an observation light irradiation surface side of the exposure apparatus, is not directly exposed to the surrounding atmosphere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.