Electrostatic chunks
US6608745B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2001 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Sep 4, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6833
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck includes a chuck body, an insulating layer formed on a surface of the chuck body and having an installation surface on which a wafer is to be installed, an inner electrode installed inside the insulating-layer, and projections projecting from the installation surface and having contact surfaces to which the wafer is to contact. A back side gas is flown into a space defined by the installation surface, the projections and the wafer, heat is supplied to the wafer, and heat of the wafer is conducted to the electrostatic chuck through the projections and the back side gas. The total area of the contact surfaces of the projections is not more than 1% of the area of the inner electrode, and the height of the projections are not less than 1 &mgr;m and not more than 10 &mgr;m.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.