Method of bulk fabricating printed wiring board laminates
US6609294B1 · kind B1 · utility
1Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2000 |
| Grant date | Aug 26, 2003 |
| Priority date | — |
| Expiry date | Jun 28, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49798
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A novel process for fabricating metal clad laminates used in the manufacture of printed wiring boards. The process which eliminates multiple use separator plates within laminate books during buildup and pressing, utilizes a sacrificial separator sheet between copper sheets and wherein the separator sheet remains intact throughout the pressing and cutting steps and is finally removed after the laminates have been sized to the desired dimensions. This process provides time and cost savings, as well as a significant increase in quality and quantity of the laminates produced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.