Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate
US6610190B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2001 |
| Grant date | Aug 26, 2003 |
| Priority date | — |
| Expiry date | Feb 28, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A system for depositing materials on a surface of a wafer or removing materials from the surface of a wafer includes an electrode, a shaping plate, a liquid solution contained between the electrode and the wafer surface, and electrical contact members contacting selected locations on the wafer surface. The shaping plate is supported between the electrode and the wafer surface such that an upper surface of the shaping plate faces the wafer surface. The shaping plate can have a plurality of channels where each puts the wafer surface in a fluid communication with the electrode. The electrical contact members contact the selected locations on the wafer surface through a recessed edge of the shaping plate such that when the wafer is rotated, the selected contact locations move over the shaping plate and are plated under an applied potential. Advantages of the invention include substantially full surface treatment of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.