Electro deposition chemistry

US6610191B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Uziel Landau · Shaker Heights, US
• John D'Urso · Shrewsbury, US
• David B. Rear · Chardon, US

Key dates

• Filing date: Nov 13, 2001
• Grant date: Aug 26, 2003
• Expiry date: Dec 3, 2021

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D3/38
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.