Nickel coated copper as electrodes for embedded passive devices
US6610417B2 · kind B2 · utility
11Cited by
11References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2001 |
| Grant date | Aug 26, 2003 |
| Priority date | — |
| Expiry date | Dec 22, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12993
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to the manufacture of metal foil electrodes useful in the manufacture of printed circuit boards having passive circuit components such as capacitors, resistors or inductors configured in a planar orientation. A copper foil is coated on each opposite side with a thin layer of nickel, which increases the range of functionality of the foil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.