Method and apparatus for fabricating encapsulated micro-channels in a substrate
US6610605B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2001 |
| Grant date | Aug 26, 2003 |
| Priority date | — |
| Expiry date | Jun 28, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/80
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for fabricating encapsulated micro-channels in a substrate is described. The method includes the formation of a thin film layer over an area of a substrate. Following the formation of the thin layer, a periodic array of access holes are formed within the thin film layer along dimensions of one or more desired micro-channels. Following formation of the access holes, the one or more micro-channels are formed, via the access holes, within an underlying layer of the substrate. Finally, the one or more micro-channels are encapsulated, thereby closing the one or more access holes along the dimensions of the desired micro-channels. Accordingly, the method is suitable in one context for rapid prototyping of micro-electromechanical systems in the areas of, for example, RF micro-systems, fluidic micro-systems and bio-fluidic applications. In addition, the method enables the rapid prototyping of integrated circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.