Opto-electronic substrates with electrical and optical interconnections and methods for making
US6611635B1 · kind B1 · utility
94Cited by
98References
45Claims
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Key dates
| Filing date | Apr 20, 1999 |
| Grant date | Aug 26, 2003 |
| Priority date | — |
| Expiry date | Apr 20, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is device and/or material integration into thin opto-electronic layers, which increase room for chip-mounting, and reduce the total system cost by eliminating the difficulty of optical alignment between opto-electronic devices and optical waveguides. Opto-electronic devices are integrated with optical waveguides in ultra thin polymer layers on the order of 1 &mgr;m to 250 &mgr;m in thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.