Method for treating polymer surface
US6613434B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2002 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Jan 31, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31507
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention concerns a method for treating a surface for the protection and functionalisation of polymers (4) by gas plasma deposit in a confined chamber (10) of one or several silicon alloy layers (43). The silicon alloy is selected among silicon and its oxides, nitrides, oxynitrides; the deposit is performed at a temperature less than the degradation temperature of the polymer, and a physico—chemical surface pre-treatment by plasma is performed in the same chamber before the silicon alloy is deposited; the pre-treatment consisting in a surface treatment comprising etching a surface zone of the polymer and step which consists in depositing a polymeric carbon compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.