Metallic material
US6613451B1 · kind B1 · utility
14Cited by
6References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2001 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Apr 12, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Ni alloy or Cu alloy containing P and/or B is plated on a base metal consisting of Cu or Cu alloy as an intermediate layer, Sn or Sn alloy is further plated on the content of P or B in the plating layer is limited by carrying out reflow treatment, whereby, heat resistance and insertion and withdrawal properties are improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.