Patent · US Expired

Lead frame for the installation of an integrated circuit in an injection-molded package

US6614100B1 · kind B1 · utility

4Cited by

35References

8Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Christian Hauser · Lappersdorf, DE
Helge Schmidt · Speyer, DE
Johann Winderl · Neunburg vorm Wald, DE

Key dates

Filing date	Dec 23, 1998
Grant date	Sep 2, 2003
Priority date	—
Expiry date	Dec 23, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/14
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

The lead frame has a spring element, which can be compressed during the injection molding of the package by an injection mold. The resultant resilience has the effect that a contact surface of the lead is pressed against an inside wall of the injection mold. The biasing of the contact surface against the inside wall prevents polymer flash from forming on the contact surface. Also, the spring element fixes the lead during the injection operation and anchors the lead in the completed package. Hold-down pins within the injection mold are thus obviated.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.