Probe structure
US6614246B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2000 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Jan 5, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07378
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention provides a probe structure in which secondary electrodes of a main base material in which probes are formed can be electrically connected to electrodes in a substrate side even when a lot of probes are formed in a large area, so that a lot of LSIs within a wafer can be tested in one lot in a wafer test process, whereby an efficiency of the test process can be improved. In the probe structure, an interposer constituted by a high rigid material is arranged between the main base material having the probes formed therein and the substrate side, and the secondary electrodes of the main base material having the probes formed therein are electrically connected to the electrodes in the substrate side via the interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.