Patent · US Expired

Hybrid wafer gyroscope

US6615681B1 · kind B1 · utility

12Cited by
14References
31Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 26, 2001
Grant dateSep 9, 2003
Priority date
Expiry dateJul 26, 2021

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T74/1293
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A hybrid wafer gyroscope includes a combination of micro-machined components and traditional electromechanical components to form a miniature gyroscope having a high degree of stability. The gyroscope includes a rotor, gimbal, flexures, and stop cutouts micro-machined out of one or more layers of silicon, forming a unitary, planar, and disk-shaped rotor subassembly, which spins about a drive shaft.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.