Hybrid wafer gyroscope
US6615681B1 · kind B1 · utility
12Cited by
14References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2001 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Jul 26, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T74/1293
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A hybrid wafer gyroscope includes a combination of micro-machined components and traditional electromechanical components to form a miniature gyroscope having a high degree of stability. The gyroscope includes a rotor, gimbal, flexures, and stop cutouts micro-machined out of one or more layers of silicon, forming a unitary, planar, and disk-shaped rotor subassembly, which spins about a drive shaft.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.