Apparatus and method for bond force control
US6616031B2 · kind B2 · utility
38Cited by
21References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2001 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Jul 17, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method are disclosed for providing bond force in a die bonding operation. The apparatus comprises means such as a compression spring for generating a primary bond force, and additionally means such as a voice coil for generating a compensatory bond force. The compensatory bond force can be controlled by varying the current to the voice coil so as to add to or reduce the bond force whereby a bond force comprising the sum of the primary bond force and the compensatory bond force may be controlled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.