Liquid crystal display devices having fill holes and electrical contacts on the back side of the die
US6617177B1 · kind B1 · utility
19Cited by
9References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 28, 2002 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Aug 28, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2201/42
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of fabricating LCOS devices and testing them at the wafer-scale to identify known-bad dice, to facilitate completing fabrication of only known-good dice. A wafer-scale transparent electrode glass is temporarily placed over the wafer, and liquid crystal material is injected into the LCOS device cavities through fill holes extending through the wafer. After removing the glass and separating the wafer into dice, only the good dice have their die-scale glass attached, liquid crystal material re-injected, solder bumps affixed, and substrate attached.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.