Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material
US6617683B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2001 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Sep 28, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microprocessor package and a method of dissipating heat therefrom have improved thermal performance by utilizing low modulus thermal interface material between the flip chip, central processing unit and a heat spreader in the package. A modulus of elasticity of the thermal interface material in the kPa range is preferably provided by a cured, filled polymer gel which is lightly crosslinked. The gel thermal interface material enables the package to have a post end-of-line and post reliability testing thermal resistance across the thermal interface material between the flip chip and the heat spreader of <0.45 cm2° C./Watt. Mitigation of thin film cracking in die and prevention of interfacial delamination upon temperature cycling are also attained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.