Repairable multi-chip package and high-density memory card having the package
US6617700B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2001 |
| Grant date | Sep 9, 2003 |
| Priority date | — |
| Expiry date | Aug 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are a repairable multi-chip package and a high-density memory card having the multi-chip package. The package includes a circuit substrate having bonding tips on a first surface and external contact pads on a second surface opposite to the first surface. The bonding tips and the external contact pads are electrically connected to each other. The package also includes at least two memory chips each mounted on the first surface and having chip pads thereon. The package includes electrically connecting members coupling each bonding tip to each chip pad, and an encapsulation layer covering the chips and the electrically connecting members. Particularly, the encapsulation layer is divided into two or more parts, and the bonding tips are partially embedded in and partially exposed out of the divided encapsulation layer. Accordingly, the exposed bonding tips can be selectively cut or re-connected for repairing the multi-chip package. Additionally, a high-density memory card having the package is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.