Engagement mechanism for semiconductor substrate deposition process kit hardware
US6620253B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2002 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Jun 5, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/137
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention includes an engagement mechanism for semiconductor substrate deposition process kit hardware, including a body having a distal portion and a proximal portion. The body is sized for movement through a passageway of a semiconductor substrate deposition chamber through which semiconductor substrates pass into and out of the chamber for deposition processing. At least engager is mounted to the distal portion of the body The engager is sized for movement through said passageway with the body. The engager is configured to releasably engage a component of process kit hardware received within said chamber. The invention includes methods of replacing at least a portion of semiconductor substrate deposition process kit hardware. The invention includes methods of depositing materials over a plurality of semiconductor substrates. Other implementations are contemplated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.