Target sidewall design to reduce particle generation during magnetron sputtering

US6620296B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• James Gogh · Sunnyvale, US
• Jim Thompson · Palo Alto, US
• Marc Schweitzer · San Jose, US
• Yoichiro Tanaka · Kawasaki, JP
• Alan Liu · Mountain View, US
• ANTHONY CHAN · Los Altos Hills, US
• Karl M. Brown · Mountain View, US
• John C. Forster · San Francisco, US

Key dates

• Filing date: Jul 13, 2001
• Grant date: Sep 16, 2003
• Expiry date: Jul 13, 2021

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C14/564
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

An apparatus for a physical vapor deposition system includes a target having a sidewall having an undercut thereon defining a net erosion area and a net redeposition area.