Patent · US Expired

Method for processing substrates

US6620735B2 · kind B2 · utility

6Cited by

5References

3Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Stefan Pinter · Reutlingen, DE
Holger Hoefer · Tegernsee, DE

Key dates

Filing date	Nov 21, 2001
Grant date	Sep 16, 2003
Priority date	—
Expiry date	Nov 21, 2021

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for processing substrates, in which a photoresist layer is applied and structured on their surface. By blasting the substrate with particles, recesses are put into the surface of the substrate in those areas not covered by photoresist.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.