Lead frame for an integrated circuit chip
US6621151B1 · kind B1 · utility
0Cited by
15References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2000 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Feb 7, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead-frame for connecting and supporting an integrated circuit having an apertured frame with dimensions smaller than the corresponding dimensions of the chip so that chip-pad shoulder can be eliminated and the chip attach fillet is made remote from the chip corner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.