Thin, small-sized power semiconductor package
US6621152B2 · kind B2 · utility
45Cited by
11References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2001 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Jul 2, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power semiconductor package is provided. The power semiconductor package includes a chip, leads, conductive media, and a molding material. The leads have a groove in the shape of a hemisphere or a down-set. The package further includes an adhesive. The package can increase solder joint reliability and thermal performance. Also, the size of the package can be reduced, and sawing can be performed so that a burr does not occur.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.