Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film
US6621170B2 · kind B2 · utility
11Cited by
6References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2001 |
| Grant date | Sep 16, 2003 |
| Priority date | — |
| Expiry date | Apr 26, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.