Patent · US Expired

Base-pad for a polishing pad

US6623337B2 · kind B2 · utility

11Cited by
29References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 29, 2001
Grant dateSep 23, 2003
Priority date
Expiry dateJun 29, 2021

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB24D11/02
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

The invention is directed to a base-pad for placement under a polishing pad for use with a polishing fluid during a polishing operation, the base-pad having a layer with vertical elongated pores that absorb polishing fluid and that confine absorbed polishing fluid from transport laterally in the base-pad. Micropores in the layer are impermeable to the polishing fluid and permeable to gasses.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.