Base-pad for a polishing pad
US6623337B2 · kind B2 · utility
11Cited by
29References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2001 |
| Grant date | Sep 23, 2003 |
| Priority date | — |
| Expiry date | Jun 29, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D11/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention is directed to a base-pad for placement under a polishing pad for use with a polishing fluid during a polishing operation, the base-pad having a layer with vertical elongated pores that absorb polishing fluid and that confine absorbed polishing fluid from transport laterally in the base-pad. Micropores in the layer are impermeable to the polishing fluid and permeable to gasses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.