Inventor · Portland, OR, US

Diane Scott

29Patents
10h-index
15Co-inventors
68Inventor score

Filing activity: Jun 29, 2001 → Jan 19, 2018

Most-cited inventions

PatentTitleAreaCited byStatus
US9156124B2 Soft polishing pad for polishing a semiconductor substrate Performing Operations; Transporting 35 Active
US9017140B2 CMP pad with local area transparency Performing Operations; Transporting 35 Active
US9296085B2 Polishing pad with homogeneous body having discrete protrusions thereon Performing Operations; Transporting 30 Active
US8702479B2 Polishing pad with multi-modal distribution of pore diameters Performing Operations; Transporting 29 Active
US9067297B2 Polishing pad with foundation layer and polishing surface layer Performing Operations; Transporting 29 Active
US9211628B2 Polishing pad with concentric or approximately concentric polygon groove pattern Performing Operations; Transporting 20 Active
US8968058B2 Polishing pad with alignment feature Chemistry; Metallurgy 18 Active
US9067298B2 Polishing pad with grooved foundation layer and polishing surface layer Performing Operations; Transporting 18 Active
US6623337B2 Base-pad for a polishing pad Performing Operations; Transporting 11 Expired
US9180570B2 Grooved CMP pad Performing Operations; Transporting 11 Active
US9649742B2 Polishing pad having polishing surface with continuous protrusions Performing Operations; Transporting 9 Active
US8920219B2 Polishing pad with alignment aperture Performing Operations; Transporting 8 Active
US8439994B2 Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection Performing Operations; Transporting 3 Active
US10160092B2 Polishing pad having polishing surface with continuous protrusions having tapered sidewalls Performing Operations; Transporting 3 Active
US9597769B2 Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer Performing Operations; Transporting 2 Active
US8628384B2 Polishing pad for eddy current end-point detection Performing Operations; Transporting 2 Active
US9375823B2 Grooved CMP pads Performing Operations; Transporting 1 Active
US9868185B2 Polishing pad with foundation layer and window attached thereto Performing Operations; Transporting 1 Active
US9597770B2 Method of fabricating a polishing Performing Operations; Transporting 0 Active
US9931728B2 Polishing pad with foundation layer and polishing surface layer Performing Operations; Transporting 0 Active
US9555518B2 Polishing pad with multi-modal distribution of pore diameters Performing Operations; Transporting 0 Active
US9931729B2 Polishing pad with grooved foundation layer and polishing surface layer Performing Operations; Transporting 0 Active
US9597777B2 Homogeneous polishing pad for eddy current end-point detection Performing Operations; Transporting 0 Active
US9249273B2 Polishing pad with alignment feature Chemistry; Metallurgy 0 Active
US11440158B2 Coated compressive subpad for chemical mechanical polishing Performing Operations; Transporting 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.