Chemical vapor deposition method using a catalyst on a substrate surface
US6623799B1 · kind B1 · utility
269Cited by
4References
4Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 13, 2000 |
| Grant date | Sep 23, 2003 |
| Priority date | — |
| Expiry date | Jul 13, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/18
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of chemically depositing a copper film in which a bromine or iodine-containing catalyst component is employed to enhance the deposition rate. The present invention is characterized in that the catalyst component floats on the film surface during the film formation. Accordingly, a film deposition having superior step coverage and high deposition rate is obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.